Cloud & data centers
Balance capacity, channel population and long-term supply.
Memory for your workload.
AI infrastructure
System memory for host workloads complements GPU HBM; it does not replace it.
Virtualization
Plan VM density, database working sets and ECC protection.
Send the system. We’ll review the specification.
We review requirements for Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem, Supermicro, Cisco UCS. Component sourcing requirements for Samsung, SK hynix and Micron can be discussed at the BOM stage.
Include server model, motherboard revision, CPU, BIOS, existing part numbers, populated slots, target capacity, quantities and destination.
DDR4 and DDR5 are not interchangeable. RDIMM and LRDIMM mixing requires explicit platform support. All trademarks belong to their owners; no authorized partnership is implied.
CUSTOMIZATION CAPABILITIES
Customization, built around your requirements.
Brand customization
Screen-printed logos, PCB color options, product packaging and brand labels tailored to your distribution program.
Specification customization
Select capacity, data rate, voltage and operating temperature to match your application and platform requirements.
Structural customization
Review PCB layer count, layout, heat spreaders and special dimensions with our engineering team.
Application customization
Discuss wide-temperature industrial, vibration-sensitive vehicle and embedded applications. Test scope and qualification are agreed for each project.
End-to-end delivery
Requirements review → Engineering proposal → Sample build → Testing and validation → Volume production.